3D Solder Paste Inspection (SPI) is a technology used for soldering process control in the electronics manufacturing industry. By using optical or laser scanning technology, it can quickly and accurately detect the quality and accuracy of solder paste during the soldering process.

1、Solder Paste Quality Inspection: It is able to detect the quality of solder paste during the soldering process, such as thickness, shape, distribution, etc., in order to ensure the reliability and stability of the soldered connection.

2、Offset detection: able to detect the offset of solder paste position during the soldering process to ensure the accuracy and precision of soldering.

3、Defect detection: able to detect solder paste defects during the soldering process, such as too much, too little, misalignment and other issues, in order to avoid the impact on product quality and performance.

4、Data analysis and recording: able to record and store the results and statistics of each inspection for subsequent analysis and traceability.

Through 3D solder paste inspection, comprehensive control and optimisation of the soldering process can be achieved, improving soldering quality and reliability, and reducing defects and errors in production. This is very important for the electronics manufacturing industry to improve product quality and performance and reduce production costs and risks.

(AOI ) Automatic Optical Inspection is an advanced technological device mainly used for quality inspection of circuit boards and assemblies in the electronics manufacturing industry. It can quickly and accurately detect defects, errors and anomalies on circuit boards by using optical technology and image processing algorithms.

1、Defect detection: able to detect defects on circuit boards, such as soldering problems, missing components, short circuits, open circuits, etc., in order to ensure the quality and reliability of circuit boards.

2、Component Position Detection: able to detect the position and orientation of components on the circuit board to ensure the correct installation and positioning of components.

3、Welding quality detection: able to detect the welding quality, such as poor welding, welding short circuit, etc., to ensure the reliability and stability of the welding connection.

4、Printing quality inspection: able to detect the printing quality on the printed circuit board, such as printing position, printing offset, etc., to ensure the accuracy and integrity of printing.

5、Data analysis and recording: able to record and store the results and statistics of each inspection for subsequent analysis and traceability.

By automating the optical inspection process, AOI is able to quickly and accurately detect quality problems on circuit boards and assemblies, improving production efficiency, reducing labour costs and ensuring product quality and reliability.

FAI First Article Inspection is the process of first article inspection of PCBA (Printed Circuit Board Assembly). In the PCBA manufacturing process, first article inspection is a key quality control step to verify that the first article of a new product or process meets the design requirements and specifications.

1、first piece verification: verify that the first piece of a new product or a new process meets the design requirements and specifications to ensure its reliability and performance.

2、Component Installation Inspection: Detect whether the components on the PCBA is correctly installed, welding, and welding quality to meet the requirements.

3、Welding quality test: detect the welding quality of the welding point, such as welding slag, bad welding, etc.

4、Electrical test: conduct electrical test on PCBA to verify whether the circuit connection is normal and whether the electrical performance meets the requirements.

5、Functional testing: Functional testing of PCBA to verify whether its function is normal.

6、Data analysis and recording: Record and store the results and statistics of first piece inspection for subsequent analysis and traceability.

Through PCBA FAI first piece inspection, problems in the PCBA manufacturing process can be found and corrected in time to ensure that the quality and performance of new products or new processes meet the requirements. This is very important for the electronics manufacturing industry to improve the quality and reliability of PCBA and reduce defects and errors in production.

In-Circuit Test (ICT) test is a commonly used electrical test method to verify the correctness of the circuit connections on the PCBA and whether the electrical performance meets the requirements.ICT test is usually carried out in the final stage of PCBA manufacturing to ensure the quality and reliability of the PCBA.

1、Prepare test fixtures: According to the design and layout of PCBA, make corresponding test fixtures for fixing and contacting PCBA.

2、Connecting test instruments: Connect the test fixture to ICT test equipment, including test probes, test instruments and power supply.

3、Test Point Definition: According to the design and layout of PCBA, define the circuit connection points to be tested, including voltage, current, signal, etc.

4、Conducting tests: Place the PCBA on the test fixture, contact the test points through the test probes, and conduct electrical tests, including resistance, capacitance, inductance, short circuit, open circuit, etc.

5、Analyse test results: According to the feedback and test data from the test instrument, analyse whether the electrical performance of the PCBA meets the requirements.

6、Record and store: Record test results and data for subsequent analysis and traceability.

Through the PCBA ICT test, problems in the PCBA manufacturing process can be found and corrected in a timely manner to ensure that the circuit connection is correct and the electrical performance meets the requirements. This is very important for the electronics manufacturing industry to improve the quality and reliability of PCBA and reduce defects and errors in production.

X-Ray Testing is a non-destructive test method used to check the quality of soldering and assembly inside a PCBA. By using X-ray technology, details such as solder joints, pads, component locations and connectivity inside the PCBA can be viewed to detect possible defects and problems.

1、Soldering quality inspection: Through X-ray images, it is possible to check whether solder joints are intact, whether pads are correctly connected to components, and whether there are any problems with soldering such as bubbles, cracks, or cold soldering.

2、Component position detection: Through X-ray image, we can check whether the components are correctly mounted on the PCBA, whether the position is accurate, and whether there is any problem of misalignment or offset.

3、Connected wire detection: Through X-ray images, we can check whether the wires on the PCBA are correctly connected, and whether there are problems such as short circuit, broken circuit or misalignment.

4、Hidden Defects Inspection: Through X-ray images, hidden defects inside the PCBA can be inspected, such as air bubbles, foreign objects, metal debris under the soldering points, and so on.

X-Ray Testing can help manufacturers find and solve problems in the PCBA manufacturing process in time and improve product quality and reliability. It is widely used in the electronics manufacturing industry, especially for high-density and complex PCBA inspection, which can provide more comprehensive and accurate inspection results. Such as aerospace, communications, medical devices and automotive electronics. It can provide fast, accurate and reliable inspection results to help ensure the quality and reliability of PCBA.

PCBA (Printed Circuit Board Assembly) functional test is a series of tests on the assembled circuit board, designed to verify that the various components and functions on the circuit board work properly.

1、Electrical testing: By testing the electrical connections, voltages, currents and other parameters on the board to ensure that the electrical performance of the board meets the design requirements. This can be done through the use of test fixtures and test instruments (e.g. multimeters, oscilloscopes, etc.).

2、 Functional testing: Testing the operation of individual components and functions on a circuit board by simulating or using actual input signals. For example, for a control circuit board, various commands and signals can be input to test the response and output of the control circuit as expected.

3、Communication Test: For circuit boards with communication functions, it is necessary to test whether the communication between them and other equipment or systems is normal. This can include testing the data transmission of serial communication interfaces (e.g., UART, SPI, I2C, etc.), as well as network communication interfaces (e.g., Ethernet, wireless communication, etc.) connection and data transmission.

4、Temperature testing: Some boards may need to work in high or low temperature environments, so temperature testing is required to verify the board’s performance and reliability under different temperature conditions.

5、Reliability testing: Evaluate the reliability and durability of a circuit board by simulating its operation over a long period of time or in a specific environment. This can include vibration testing, shock testing, temperature cycling testing, etc.

The purpose of PCBA functional testing is to ensure that the board works properly in actual use and meets design and specification requirements. By conducting comprehensive functional testing, product quality and reliability can be improved, failure rates can be reduced, and customer needs can be met.

DIP Insert AOI Inspection is a method of inspecting the quality of DIP Inserts using an Automated Optical Inspection (AOI) system.DIP Inserts are a commonly used form of electronic component packaging, and DIP Insert AOI Inspection can be used to achieve the correctness and quality of the DIP Inserts on a Printed Circuit Board (PCB).

The DIP insert AOI inspection system usually consists of a conveyor system, a camera, and a light source. the DIP insert on the PCB is moved through the conveyor system into the field of view of the camera, which captures a high-resolution image of the DIP insert. These images are processed and analysed, and using advanced image processing algorithms and template matching technology, defects in the DIP inserts can be detected, such as missing, misaligned, incorrect polarity, bent or damaged pins, soldering issues, etc.

The DIP plug-in AOI inspection system can compare with CAD data or predefined reference images to identify any defects or anomalies. When defects are detected, the system can trigger alarms, flag faulty inserts, or even automatically reject the entire PCB.

Overall, DIP insert AOI inspection is an important tool in the electronics manufacturing industry, helping to ensure the quality and reliability of DIP inserts in PCB assembly.

PCBA programme burning is the process of loading pre-written programme code into a microcontroller or memory on a PCBA (Printed Circuit Board Assembly).

1、Preparation of Burning Device: First of all, it is necessary to prepare a burning device, such as burner, programmer or automatic burning device integrated in the production line. The burner device usually needs to be connected to the burner interface on the PCBA, such as JTAG, SPI, ICSP, etc.

2、Getting the programme code: Convert the pre-written programme code into a format suitable for the burning device, e.g. HEX, BIN, etc.. This can be done through a compiler, integrated development environment (IDE) or specialised burning software.

3、Connect the burning device: Connect the burning device to the burning interface on the PCBA. Make sure the connection is correct and stable.

4、Set the burn-in parameters: According to the characteristics and requirements of the PCBA, set the parameters of the burn-in device, such as clock frequency, voltage, and so on. These parameters can be set according to the design specifications of the PCBA or the recommendations provided by the manufacturer.

5、Erase memory: If other programme code already exists in the memory on the PCBA, it needs to be erased first to make room for the new programme code.

6、Burn program code: Load the converted program code into the microcontroller or memory of the PCBA. This can be done through the software interface of the burning device or through the command line interface.

7、Verify Burn-in Results: After the burn-in is complete, perform a verification to ensure that the program code is loaded correctly onto the PCBA. This can be done by reading the contents of the memory on the PCBA and comparing it with the burned program code.

8、Recording and reporting: The results of the burn-in are recorded and corresponding reports are generated. This helps with quality control and traceability, as well as subsequent product maintenance and upgrades.

PCBA programme burn-in is an important part of electronics manufacturing, ensuring the correctness and reliability of the programme code loaded in the microcontroller or memory on the PCBA.

PCBA Electrical Performance Testing is the process of evaluating and verifying the overall electrical performance of a circuit board after assembly. It aims to ensure that the PCBA can work properly in actual use and meet the design and specification requirements.

1、Preparation of test equipment: First of all, it is necessary to prepare test equipment applicable to PCBA, such as multimeters, oscilloscopes, signal generators and so on. These devices will be used to measure and verify the electrical parameters and performance on the PCBA.

2、Connect the test equipment: Connect the test equipment to the test interface on the PCBA. This can be done by connecting wires or test fixtures, etc. Make sure the connection is correct and stable.

3、Measure Electrical Parameters: Use the test equipment to measure various electrical parameters on the PCBA, such as voltage, current, frequency, resistance, etc. This can be done either by direct measurement or by applying a specific test fixture. This can be done by direct measurement or by applying specific test signals.

4、Verify Functionality: Verify that the various functional modules of the PCBA are working properly by applying appropriate test signals and analogue inputs. This can include input and output ports, communication interfaces, sensors, actuators, etc.

5、Perform Load Testing: Under normal operating conditions, apply appropriate loads to the PCBA to verify its performance and stability under load. This can include testing the stability of the power supply, the impact of temperature changes on circuit performance, etc.

6、Recording and Reporting: Record test results and generate appropriate test reports. This helps quality control and traceability, as well as subsequent product maintenance and improvement.

PCBA electrical performance testing is an important part of ensuring the quality and reliability of PCBA, which can identify potential failures and problems, and take timely measures to repair and improve.

PCBA Aging Test is the process of evaluating and verifying the reliability of PCBAs under prolonged use and environmental changes. It aims to simulate the aging of PCBA in actual use to determine whether it can maintain stable and reliable performance in long-term operation.

1、Designing the aging test programme: According to the design specifications of the PCBA and the environment in which it is to be used, the parameters and conditions of the aging test are determined. This includes aging time, temperature, humidity, voltage and so on. You can refer to relevant industry standards or empirical data for design.

2、Set up aging test equipment: Prepare equipment suitable for aging test, such as aging box, constant temperature and humidity box, power supply regulator and so on. According to the test programme to set the parameters of the equipment, such as temperature, humidity, voltage and so on.

3、Place the PCBA in the aging test equipment: Place the PCBA in the aging test equipment and make sure its connection with the test equipment is stable. According to the conditions set in the test programme, expose the PCBA to the corresponding environment.

4、Run the aging test: according to the time set in the test programme, run the aging test. During the period, monitor the PCBA’s electrical parameters and performance changes, such as voltage, current, frequency, resistance, etc.. Test equipment can be used for real-time monitoring or regular sampling.

5、Verify aging test results: After the aging test is completed, conduct functional and performance tests on the PCBA to verify its reliability and stability under aging conditions. This can include verifying functional modules, communication interfaces, input and output ports, etc.

6、Record and Report: Record the results of the aging test and generate the corresponding test report. This helps with quality control and traceability, as well as subsequent product maintenance and improvement.

PCBA aging test is an important part to ensure that PCBA can maintain stability and reliability in long-term use, it can find potential aging problems and take timely measures to repair and improve.