Production and Inspection Capabilities
Tortai, not only provide PCBA one-stop service, but also provide customers with a variety of different materials, special processes, surface treatment of PCB circuit boards. Each piece of PCB adopts high quality raw materials and undergoes strict testing, each production link has QC special inspection, operator self-inspection, QA sampling product layers of control, factory products can be certified by UL, CE, MIN standards, ISO-9001, ISO 13485 ：2016, IATF 16949 ：2016, ISO 14001 ：2015, the EU SGS lead-free product certification. The company has experienced professional process team and quality control system, can provide a variety of special process PCB boards, such as: impedance board special ink (matte ink, purple, etc.) blind buried holes in the ultra-long, ultra-thin plate countersunk holes in the OSP process of thick copper boards, bare copper boards of high-frequency and high-speed HDI and so on. At the same time, we are also able to meet the needs of customers in various fields by providing a wide range of materials: FR4, Teflon, ceramic, halogen-free, high TG, mixed-pressure, ultra-thin and ultra-thick plates. Refined production process, providing a variety of surface treatment processes, such as: OSP, lead-free tin spraying, immersion gold, immersion tin, immersion silver, electro-gold, etc. Tortai promises that the quality of all products meets the industry’s standards before they leave the factory.
| Working Procedure | Item | Batch Manufacturing Capability | |
| SMT | Printing | Maximum PCB size can be processed | 50*50 mm²—850*560mm²，Proofing limit 1500MM length new energy control board |
| Maximum Plate Quality | 8kg | ||
| Actual printing accuracy | ±25μm（6σ） | ||
| System Calibration Repetition Accuracy | ±10μm（6σ） | ||
| Squeegee Pressure Detection | Pressure Closed Loop Control System | ||
| SMD | Processable Component Size range | 01005 0.3*0.15 mm²～200*125 mm² | |
| Maximum height of processable components | 25.4mm | ||
| Maximum mass of processable components | 100g | ||
| BGA/CSP Minimum Ball Pitch , Ball Diameter | 0.30mm，0.15mm | ||
| SMT Accuracy | ±22μm（3σ），±0.05°（3σ） | ||
| Range of Workpiece Sizes | Regular 50*50mm², proofing limit 850*560 mm² | ||
| Plate thickness range | 0.3mm–6mm | ||
| Maximum plate mass | 6kg | ||
| Maximum number of material types that can be placed on the line | 500 stations | ||
| Vacuum Reflow Soldering | Temperature Accuracy | ±1℃ | |
| Welding Protection | Nitrogen Protection (Residual Oxygen <3000ppm) | ||
| Minimum vacuum pressure | 0.1Kpa | ||
| Nitrogen control | Nitrogen Closed Loop Automatic Control System，±200ppm | ||
| Chip (IC) bubble void rate control | Vacuum reflow <2%, conventional air/nitrogen ovens (25%) | ||
| SPI | Detectable minimum pitch of solder balls | 100μm | |
| X-Y Axis Accuracy | 0.5μm | ||
| Error Rate | ≤0.1% | ||
| AOI | Detecting the smallest components | 01005‘ | |
| Detectable bad condition | Wrong material, missing parts, reverse, mounting offset, stelae, side standing, open welding, tin, turn over | ||
| Bend detection | 3D Inspection Function | ||
| First Article Inspection System | FAI Intelligent First Article Inspection System | High precision LCR bridge, basic measurement accuracy: 0.5%, test frequency: 50Hz-100kHz | |
| 3D X-Ray | Magnifying Power | Geometric magnification 2000; systematic magnification 12000 | |
| Rotation & Tilt Angle | any ±45° + 360° rotation | ||
| Resolution | 1μm /nm | ||
| DIP | Pre-Processing | Automated component moulding technology | Automatic component forming |
| Plug-in | Plug-in Technology | Automatic Insertion Machine | |
| Wave Soldering | Wave Soldering Types | General wave soldering, selective wave soldering | |
| Inclination of transport rails | 4–7° | ||
| General wave soldering temperature accuracy | ±3℃ | ||
| Selective wave wave soldering stabilises accuracy | ±0.06 mm | ||
| Crimping Technology | Maximum size of crimped PCB | 800*600mm² | |
| Downward pressure height accuracy | ±0.02mm | ||
| Pressure range | 0-50KN | ||
| Pressure precision | ± 2 per cent of standard value | ||
| Pressure Holding Time | 0—9.999S | ||
| Three-proof coating technology | Maximum processing plate size | 500*475*6mm³ ，Proofing limit 1500MM length new energy control panel | |
| Maximum mass of veneer | 5kg | ||
| Minimum nozzle diameter | 2mm | ||
| Other characteristics | Spray pressure programme control | ||
| Precision Glue Filling | Itinerary of work | L700mm*W700mm | |
| Height range | 0~100mm | ||
| Motion Tolerance | ±0.02mm | ||
| Proportion of glue | 10:1-10:10 | ||
| Glue viscosity range | MAX≤20000 | ||
| AB Glue Output Tolerance | ±2% | ||
| ICT Test | test level | Component level testing to test hardware connection status | |
| Number of test points | ＞4096 points | ||
| Test content | Contact test, open and short circuit test, resistance-capacitance test, secondary and tertiary FET test, unpowered hybrid test, boundary scan chain test, power-on hybrid mode test | ||
| Assembly and Testing | Product Series | New Energy Industry | Home energy storage, PV inverters, power management systems (PMS), battery management systems (BMS), energy storage converters (PCS), etc. |
| Security Industry | Cameras, automatic access control, fire alarm systems, hazardous gas sensing devices, smoke alarms, explosion-proof instruments and equipment | ||
| Industrial Controls | Industrial computers, automation aids, industrial robots, inverters, motor drives, motion controllers, all kinds of sensors | ||
| Communications Industry | Network communication switches, routers, APs, optical communication modules, communication base station power supply, IoT modules, positioning systems, etc. | ||
| Medical Industry | Oxygen generator, medical monitor, blood pressure monitor, blood oxygen meter, blood analyzer, ventilator, infusion pump, intelligent medical bed, light therapy machine, etc | ||
| Temperature cycling test | Temperature Range | -60℃–125℃ | |
| Temperature rise and fall rate | ＞10℃/min | ||
| Temperature Deviation | ≤2℃ | ||
| Other reliability analysis tests | Plating analysis, ultrasonic inspection, component opening + internal visual inspection, SEM observation, EDS, solderability test, acetone corrosion, electrical performance test, chip authenticity analysis, metallographic section (fixed or non-fixed point), plane grinding, cold and hot shock test, functional test, failure analysis, aging test, ROHS test, drop, vibration, salt spray, water immersion, key life and other tests. | ||
| Programming | Burning mode | Online burning, offline burning, fully automatic batch burning | |
| In-Chip Type | MCU、FLASH、CUP、RAM、ROM、DDR | ||
| Chip Brands | Imported (ST, Tl, NXP, RENESaAS, MICROCHIP, etc.), domestic (Zhaoyi, Xintang, Zhongying, Fudan Microelectronics, STC, Shanghai Beiling, etc.) | ||
| Fixture making | Designing customised test fixtures | Product Load Test Fixture | |
| Simulated product usage scenario testing | |||
| Boot up Self-Test | |||
| Upper computer test | |||
| Tommunications Test | |||
| Management tools/software | IMS | Assisting warehouse, stock preparation team and production in material management | |
| MES | Manufacturing execution system, mainly used for production process control, ECN execution control, anti-defective control, data traceability, etc. | ||
| Oracle | Purchasing process, cost, finance, work order planning, etc. management | ||
| ECN System | ECN management system to avoid missed ECNs and respond quickly to engineering change projects | ||
| Labview | Provide a graphical programming environment to enhance the data acquisition, analysis, monitoring and management capabilities of equipment and instruments in the manufacturing process, and at the same time, make the communication between terminal computers closer and facilitate the construction of the system. | ||
| IP-guard | Application Control | ||
| Factory Certification | Certification system | ISO9001、ISO14001、ISO13485、IATF16949 | |
| Quality Standards | Manufacturing Standard | IPC-A-630；Including Raw Material Procurement, Production Process, Process Control, Etc. | |
| Test Standard | IPC-TM-650；Including Functional Testing, Reliability Testing, Environmental Testing, Etc. | ||
| Assembly Standards | IPC-A-610；Including Component Mounting, Soldering, Packaging, Etc. | ||
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