3D Solder Paste Inspection (SPI) is a technology used for soldering process control in the electronics manufacturing industry. By using optical or laser scanning technology, it can quickly and accurately detect the quality and accuracy of solder paste during the soldering process.
1、Solder Paste Quality Inspection: It is able to detect the quality of solder paste during the soldering process, such as thickness, shape, distribution, etc., in order to ensure the reliability and stability of the soldered connection.
2、Offset detection: able to detect the offset of solder paste position during the soldering process to ensure the accuracy and precision of soldering.
3、Defect detection: able to detect solder paste defects during the soldering process, such as too much, too little, misalignment and other issues, in order to avoid the impact on product quality and performance.
4、Data analysis and recording: able to record and store the results and statistics of each inspection for subsequent analysis and traceability.
Through 3D solder paste inspection, comprehensive control and optimisation of the soldering process can be achieved, improving soldering quality and reliability, and reducing defects and errors in production. This is very important for the electronics manufacturing industry to improve product quality and performance and reduce production costs and risks.