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What is poor pin tinning? Why does the pin stick poorly? How to fix the pin with bad tin?   Poor pin tinning is usually […]

Flexible Printed Circuit Board (FPC) after the furnace shrinkage problem is what? How to solve the flexible printed circuit board (FPC) after the furnace shrinkage

What is the problem of discolouration of plating in baking after cutting for PCB manufacturing? Why is there a problem of discolouration of the plated

Tips for adjusting to changing customer forecasts. The EMS industry is running true to acycle no one likes: big drops in demandfollowing a period of

1、IPC-ESD-2020: electrostatic discharge control procedure development of the joint standard. Includes the design, establishment, implementation and maintenance necessary for electrostatic discharge control procedures. Based on

With the electrochemical energy storage in the power system continues to promote the application, there is a container type mobile energy storage system is entering

Precision dispensing and encapsulation technologies are critical steps in the PCB assembly manufacturing process that ensure electronic components are properly mounted and protected to ensure

With the development of electronic technology, electronic components towards miniaturisation and high density integration of the direction of development, BGA components have been more and

During the use of electronic products, the temperature is constantly changing due to temperature variations between components and PCB boards, such as when the device