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PCBA programme burning is the process of loading pre-written programme code into a microcontroller or memory on a PCBA (Printed Circuit Board Assembly). 1、Preparation of […]

DIP Insert AOI Inspection is a method of inspecting the quality of DIP Inserts using an Automated Optical Inspection (AOI) system.DIP Inserts are a commonly

PCBA (Printed Circuit Board Assembly) functional test is a series of tests on the assembled circuit board, designed to verify that the various components and

X-Ray Testing is a non-destructive test method used to check the quality of soldering and assembly inside a PCBA. By using X-ray technology, details such

In-Circuit Test (ICT) test is a commonly used electrical test method to verify the correctness of the circuit connections on the PCBA and whether the

FAI First Article Inspection is the process of first article inspection of PCBA (Printed Circuit Board Assembly). In the PCBA manufacturing process, first article inspection

(AOI ) Automatic Optical Inspection is an advanced technological device mainly used for quality inspection of circuit boards and assemblies in the electronics manufacturing industry.

3D Solder Paste Inspection (SPI) is a technology used for soldering process control in the electronics manufacturing industry. By using optical or laser scanning technology,