PCBA-assembly2

Have Own Factory——Reliable And Quality Guaranteed

TORTAI are experts in designing, engineering, and manufacturing of printed circuit boards. For more than 18 years, we have developed our expertise and worked with clients across different industries to deliver the very best in PCB assembly services. Our own PCB assembly technology experts partner with some of the best PCB manufacturers. Over the years we have been serving our clients, we have built strong relationships with each of our partners. Our team can help with a range of PCB assembly needs, ensuring all of our clients are satisfied with the results that they receive from our services.

TORTAI strictly adheres to the IPC-A-610 quality control standards. To better control the soldering quality of the products, it is equipped with a three-dimensional solder paste inspection device (3D SPI), a fully automatic optical inspection instrument (3D AOI), an X-ray detector, and high-definition microscopes, among other complete quality control equipment for the SMT process.

Each SMT production line is equipped with a fully automatic optical inspection instrument (3D AOI), which can detect various defects such as component offset after welding, insufficient soldering, short circuit, contamination, missing parts, skewing, standing upright, side-up, flipping, wrong parts, damage, floating height, polarity, open circuit, no soldering, overflow glue, tin holes, and pin not protruding.

Additionally, we have deployed high-capacity, high-resolution, and high-magnification X-RAY inspection systems to ensure the soldering quality of BGA components.

TORTAI Offers a free DFM check that can help customers avoid obvious mistakes.

 

Excellence Begins With Every process

12 inspection procedures forge excellence

Incoming Quality Control (IQC) Solder Paste Inspection (SPI) In-line AOI Inspection.jpg First Article Inspection (FAI)

Incoming Quality Control (IQC)

Purpose: To implement stringent quality control over materials supplied by vendors, ensuring that components entering the production process meet specified standards. This prevents process defects arising from substandard materials and minimises time losses caused by the use of refurbished materials that fail to meet quality requirements.

Solder Paste Inspection (SPI)

Purpose: Employing advanced optical inspection technology to conduct comprehensive assessment of solder paste printing quality, enabling early detection of defects such as insufficient paste volume, misalignment, and bridging to prevent defective products from progressing to subsequent processes.

In-line AOI Inspection

Purpose: Utilising advanced machine vision technology to perform automated optical inspection on products during production. This enables rapid and accurate identification of defects such as incorrect parts, missing components, and reversed parts, whilst intercepting substandard materials before they enter subsequent processes.

First Article Inspection (FAI)

Purpose: To verify the correctness of the assembly process on the production line and ensure that the parameters of each resistive and capacitive component (such as resistors, capacitors, etc.) fall within the specified standard range.

IPQC Offline AOI Inspection X-Ray Testing In-Circuit Test (ICT)

IPQC

Purpose: To conduct random inspections of all production processes to verify compliance with work instructions.

Offline AOI Inspection

Purpose: To inspect surface-mounted PCBA assemblies post-soldering for defects such as missing components, reverse soldering, and short circuits in accordance with the IPC-610D standard.

X-Ray Testing

Purpose: To inspect solder joints on components invisible to the naked eye, ensuring the reliability of each solder ball on BGAs.

In-Circuit Test (ICT)

Purpose: To swiftly and accurately identify various defects arising during the manufacturing process after PCB assembly is complete, thereby ensuring product quality and reliability.

Functional Test(FCT) Manual QC Inspection QA Outbound inspection ESD-Safe Storage & Shipping

Functional Test(FCT)

Purpose: To simulate the product’s ultimate real-world operating environment by conducting power-up testing on assembled PCBA units or complete systems, verifying that their functionality, performance, and behaviour fully comply with design specifications.

Manual QC Inspection

Purpose: To conduct rigorous manual inspection of finished boards in accordance with the IPC-610 inspection standard, ensuring 99.98% of products shipped are of acceptable quality.

QA Outbound inspection

Purpose: To conduct rigorous inspection prior to dispatch and verify via barcode scanning, thereby preventing non-compliant products from being shipped.

ESD-Safe Storage & Shipping

Purpose: To ensure anti-static packaging and provide safe protection during storage or dispatch operations.

Get in Touch with Us

Simply get in touch with us to discuss your requirements. Use our online form to send us your information for a free quote or just to discuss how we can help you. You can also E-mail us directly at sales@tortai-tech.com to speak to a PCB assembly specialist and receive more information.

When you get in touch with our expert team, you will receive the best advice on PCB design, manufacturing, assembly, and prototyping. Take a look at our PCB assembly capabilities to see what we can do for you and what we are truly capable of.

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PCB Assembly Case

 

Intelligent Tea Machine Intelligent Water Valve Controller Intelligent Door Lock Control Board BMS Protection Board
Intelligent Tea Machine Control Board Intelligent Water Valve Controller Intelligent Door Lock Control Board BMS Protection Board
Power Control Board Industrial Control Boards Ultrasonic Bone Density Tester Automated Haemostat Control Board
Power Control Board Industrial Control Boards Ultrasonic Bone Density Tester Automated Haemostat Control Board

 

PCB Assembling Capabilities

 

Item Capability
Quality Standard ▪ IPC-A-610
Assembly Technology ▪ SMT Stencil  ▪ SMT   ▪ DIP  ▪ Conformal Coating
Enterprise Certification ▪ ISO9001  ▪ ISO13485  ▪ ISO14001
Product Certification ▪ UL   ▪ RoHS   ▪ SGS   ▪ REACH
SMD Capability ▪ Support: 01005, 0.3*0.15mm~200*125mm, BGA/CSP Minimum Ball Pitch: 0.15mm, 0.30mm, QFN, CSP, CON, etc.

▪ Conventional: 50mm*50mm, Sampling Limit PCB Board Size: 850mm*560mm

Value-added features

▪ Component procurement ▪ NPI Report  ▪ PCBA Prototype

▪ IC Programming  ▪ Repair

Testing process

▪ AOI  ▪ X-ray  ▪ SPI  ▪ FAI  ▪ FCT  ▪ ICT  ▪ Aging test

 ▪ QC Manual detection

Damp-proof process ▪ Conformal Coating ▪ Nanocoating  ▪ Low-pressure injection molding  ▪ Glue feed
Order capability ▪ ​Order from 10 pieces

6 Types of PCB Assembly Services

 

Rigid PCB10 Flexible Single-Sided12 Multilayer soft and hard bonded board
Rigid PCB Flexible PCB Rigid-Flex PCB
DIP plug-in welding service Three-proof paint spraying service Electronic Potting Service
DIP Plug-in Welding Service Three-Proof Paint Spraying Service Electronic Potting Service

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Order Process

 

Order-Process1

 

Essential Documents for Accurate PCB Assembly Quotes

 

Obtaining precise quotes for PCB assembly projects is crucial for successful manufacturing processes. Several key documents play a vital role in this process, providing essential information for accurate quoting. The following documents are indispensable when requesting a quote for a PCB assembly project:
  1. Bare Board Print: This foundational document provides vital details about the bare circuit board, serving as a crucial reference for the assembly process.
  2. Bill of Material (BOM): The BOM lists all components required for assembly, including part numbers, quantities, and descriptions.
  3.  Gerber: Outlining component placement on the board during assembly, this document ensures accuracy and efficiency.
  4. Approved Vendor List: Ensures high-quality materials and components are used in the assembly process.
  5. Stack-up Details: Information about layers and materials used in the PCB stack-up is essential for accurate quoting.
  6. PCB Process Requirements: Specifications regarding solder mask application and requirements are crucial for the assembly process.
  7. Product Process Requirements: Information about any cut-outs or special features on the board that impact assembly processes.

By ensuring that these documents are complete and detailed, individuals and businesses can receive precise quotes tailored to their specific project needs, leading to successful and cost-effective PCB assembly processes.

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1、What is the difference between electronic contract manufacturing services and OEM?

A: An OEM contractor is an outsourcing company that manages the creation of equipment that cannot be manufactured by a rental company. OEM contract services exist in almost every industry and allow major manufacturers to expand their product or service lines with minimal additional expense.

2、What is PCB assembly

A: PCB assembly is the process of assembling all electronic components such as resistors, transistors, diodes, etc. onto a printed circuit board, and the assembly method can be manual or mechanical.

3、Are you a certified PCB manufacturer?

A: Yes, Tortai is ISO9001 certified, ISO13485, IATF 16949, ISO14001, IPC, and UL certified and our factories and manufacturing processes follow strict industry regulations and standards.

4、Do you accept small orders?

A: Yes. We use a flexible ordering mechanism, there is no minimum order quantity for our products; the order quantity is entirely up to you.

5、Can you handle multi-layer PCB assembly?

A: Sure, we can assemble PCBs from 1-32 layers.

6、Do you offer RoHS compliant PCB components?

A: Yes; We can provide lead-free components that comply with EU RoHS standards.

7、What is the cost of PCB Assembly?

A:The cost of PCB assembly is affected by a variety of factors, such as component type, order quantity, number of components, labour costs, etc.

8、Are you capable of fine pitch assembly?

A: Yes, We have mounting capabilities for 01005 and 0201 sizes.

9、Do you have the ability to install a BGA?

A: Yes, We can install BGAm, MBGA, LGA. And BGA rework equipment.

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