Answer: This is an excellent question that gets to the heart of our strategic positioning. Large EMS providers like Foxconn are experts in high-volume, mass production of consumer electronics. In contrast, we have intentionally optimized our entire operation to serve a different yet equally critical niche: projects characterized by high complexity, high reliability, and low-to-mid volume production runs (typically from 50 to 10,000 units).

Our advantage is not about being generically “better,” but about being “a more suitable partner for specific types of clients.” Below is a detailed analysis of our core differentiators:

In essence, you choose us when you need more than just a manufacturer—you need a true engineering partner. Our value is most pronounced during the early stages of your project. We invest significant resources in Design for Manufacturability (DFM) analysis, helping you mitigate design risks, optimize costs, and ensure long-term reliability before the first board is ever built. For our clients, the value of this early-stage collaboration far outweighs saving a few cents per unit in large-scale production.

Answer: We ensure quality not through a single action, but through a systematic, multi-layered Quality Assurance process that is ingrained in every operational step, from quotation to shipment. Our quality philosophy is built on the principle of “Prevention over Inspection.”

Our quality system is fully compliant with ISO 9001, ISO 13485, and IATF 16949 standards and includes the following key stages:

1、Design for Manufacturability (DFM) Review:Before any order is confirmed, our engineers perform a thorough DFM analysis to identify and eliminate potential manufacturing risks at the design stage.

2、Incoming Quality Control (IQC):All raw materials and components undergo rigorous inspection and verification upon arrival to ensure they meet specifications and are genuine.

3、In-Process Quality Control (IPQC):

• Solder Paste Inspection (SPI):3D inspection of solder paste printing before component placement to ensure correct volume and shape.
• First Article Inspection (FAI):A comprehensive specification verification of the first assembled product before batch production begins.
• Automated Optical Inspection (AOI):100% inspection of PCBA after reflow soldering to detect surface defects like component misplacement, missing parts, or wrong polarity.
• Automated X-Ray Inspection (AXI):For complex packages like BGAs and QFNs, we use AXI to detect hidden defects invisible to AOI, such as voids, shorts, and poor solder joints.

4、Final Quality Control (FQC):

• In-Circuit Test (ICT) & Functional Test (FCT):We design and execute customized functional tests to verify that the PCBA operates exactly as intended.
• Outgoing Quality Control (OQC):A final random sampling inspection before packaging and shipment to ensure all quality standards and client requirements are met.

This comprehensive system ensures that quality is “built into” your product, not just “inspected out” at the end. This is why we can confidently serve high-reliability industries like medical and automotive electronics.

Answer: Our collaboration process is designed to be transparent, cooperative, and efficient, ensuring every step from initial contact to final delivery is clear. We view it as a shared journey with you.

Here is our standard 6-step process:

Step 1: Initial Consultation & NDA

• You contact us with your project requirements. We schedule a technical discussion to gain a deep understanding of your needs.
• To protect your intellectual property, we begin by signing a mutual Non-Disclosure Agreement (NDA).

Step 2: RFQ & DFM Analysis

• You provide the complete technical package (e.g., Gerber files, BOM list).
• Our engineers will perform a complimentary DFM analysisfor you to identify potential optimization points and risks.

Step 3: Formal Quotation

• Based on the DFM feedback and your requirements, we provide a detailed, itemized quotation, including component costs, assembly fees, and testing fees.

Step 4: Contract & Purchase Order

• Once you approve the quotation, we sign a formal contract, and you issue a Purchase Order (PO) to kick off the project.

Step 5: NPI & Volume Production

• We commence component procurement and execute the New Product Introduction (NPI)process, which includes a First Article Inspection (FAI) for your approval.
• After FAI approval, we move into volume production and provide you with regular project updates.

Step 6: Delivery & Post-Sales Support

• After final quality control, we safely package and ship the products to your designated location.
• Our partnership continues after delivery, with dedicated post-sales support and warranty services.

Throughout this process, you will have a dedicated Project Manager acting as your single point of contact, ensuring smooth communication and timely responses.

Tortai Technologies Co., Ltd. is a technology-driven innovator specializing in high-reliability Electronic Manufacturing Services (EMS). Founded in 2007 and headquartered in Humen Town, Dongguan City, the company operates a production facility spanning approximately 4,000 square meters.

Core Business and Strategic Positioning Tortai Technologies’ core business is providing end-to-end EMS solutions, encompassing electronic component procurement, PCB manufacturing, SMT assembly, DIP insertion welding, PCBA testing, final product assembly, and packaging/shipping. Its strategic focus is clear:

• Specialized Sectors:It deeply serves industries with high-reliability demands, such as medical electronics, automotive electronics, new energy, industrial controls, artificial intelligence, and security.
• Order Specialty:The company excels in handling small to medium-volume orders (typically 50 to 10,000 units) characterized by high complexity and a high mix of products. This makes it ideal for customers from R&D prototyping to small and medium-scale production runs.
• Core Value:Tortai Technologies aims to be a “risk partner and provider of a reliability assurance system” for its clients. It emphasizes risk mitigation through early-stage Design for Manufacturability (DFM) analysis to ensure long-term product reliability.

Technical Capabilities and Quality Systems The company supports its high-reliability commitment through continuous technical investment and stringent quality management:

• Production and Inspection Equipment:It operates 4 Japanese YAMAHA mid-to-high-speed SMT lines, 2 DIP insertion lines, and 2 final assembly lines. A complete inspection system includes SPI solder paste inspectors, AOI, X-RAY, and ICT/FCT testing equipment, ensuring manufacturing precision and quality.
• Industry Certifications:Tortai Technologies holds several authoritative international certifications, including ISO 9001 (Quality Management), ISO 13485 (Medical Devices), IATF 16949 (Automotive), and ISO 14001 (Environmental Management), demonstrating compliance with global standards.
• Systematized Capabilities:The company is actively building systematized service capabilities, such as a “Delivery Engine System” and “Process Visualization and Data Traceability System,” to integrate manufacturing stages organically and provide clients with auditable, verifiable overall solutions.

Client Cooperation and Global Perspective Tortai Technologies has established long-term partnerships with clients from over 40 countries and regions. Its clientele includes well-known enterprises and institutions such as Roche, Sany Heavy Industry, and CRRC. The company also actively participates in international industry exhibitions like Medtec China to expand its influence in high-end manufacturing sectors like medical electronics.

Summary In summary, Tortai Technologies is not a traditional high-volume mass-production vendor but a technology-driven, reliability-centric electronic manufacturing partner. If you are seeking a manufacturing partner capable of deep collaboration and shared risk management for small to medium-volume, high-complexity electronic projects requiring high reliability, Tortai Technologies is a compelling choice.

Tortai Technologies Co., Ltd.’s ideal client profile is well-defined, and its service model is highly specialized, focusing on providing high-reliability EMS to clients in specific industries with particular needs.

Ideal Client Profile Tortai Technologies primarily serves high-tech sectors where product quality, reliability, and technical collaboration are paramount. Its ideal clients typically exhibit the following characteristics:

• Focus on High-Reliability Industries:The company has long been positioned in fields like new energy, communications, medical, transportation, AI, security, and industrial controls. A common thread is that products must operate stably under high standards and harsh conditions, demanding extreme requirements for manufacturing processes, quality control, and traceability.
• Oriented Towards R&D and Small/Medium-Batch Manufacturing:Tortai Technologies is particularly suited for clients engaged in product development, prototyping, and small to medium-volume production. This includes OEMs/ODMs, R&D-intensive companies, research institutes, and high-tech firms. It maintains collaborations with renowned international companies like Roche and CRRC, as well as serving A-share listed companies and startups.

Order Scope and Business Model Regarding order size, Tortai Technologies has a clear positioning and is not a conventional high-volume mass-production vendor.

• Specialization in Small/Medium Batches with Flexibility:Tortai Technologies explicitly focuses on providing “small-to-medium volume, high-reliability, full-process” electronic assembly services. Its typical order range is usually between 50 and 10,000 units. This allows its production lines to respond quickly to Engineering Change Orders (ECOs), making it highly suitable for projects with rapid iteration and high customization requirements.
• Providing One-Stop Comprehensive Services:Beyond core SMT and DIP assembly, Tortai Technologies offers services like electronic component procurement, PCB manufacturing, conformal coating, low-pressure injection molding, programming/testing, final assembly, and packaging/shipping. This provides significant value for clients looking to simplify supply chain management and reduce overall costs.
• Systematic Solution Provider:Tortai Technologies is transitioning from offering “point-based manufacturing services” to being a “systematic solution provider,” aiming to become a client’s “risk partner and provider of a reliability assurance system.” This means they are involved not only in production but also deeply engaged in early-stage development and risk control through DFM analysis, process visualization systems, and collaborative validation mechanisms, ensuring products are designed for high reliability and manufacturability from the outset.

Summary In essence, if you are from the aforementioned high-tech industries and are seeking a manufacturing partner for small-to-medium volume, high-complexity electronic projects that require not only precise manufacturing but also deep collaboration and shared commitment to project success, then Tortai Technologies is a highly compatible choice.

Tortai Technologies Co., Ltd. adopts “Technology enhances quality, Quality enhances service, Service creates value” as its core development tenet, building upon this a clear system of corporate mission and values.

Corporate Mission and Vision Tortai Technologies’ mission can be summarized as “Self-selection, Social Endowment.” The core is to create value for clients through commercial means while resolutely undertaking social responsibilities, with the ultimate goal of contributing to human development. The company’s vision is to become a “globally trusted electronic manufacturing service provider,” dedicated to offering high-reliability EMS to global clients.

Core Values In practice, Tortai Technologies has formed a value system centered on “Attitude determines everything, Details determine success or failure,” manifested in several aspects:

• Technology First:The company insists on technology as its foundation, continuously investing resources in process research and technological innovation to ensure the capability to handle highly complex projects.
• Quality Supremacy:The company implements strict full-inspection regimes for its products, pursuing quality standards that exceed customer expectations, which it considers the basis for earning long-term trust.
• Achievement Sharing:The company practices the business philosophy of “Value Co-creation, Achievement Sharing,” activating team vitality through mechanisms like a partnership model, allowing all employees to share in the fruits of development.

Business Philosophy and Practice Tortai Technologies bases its operational philosophy on “Customer-centricity, Striver-oriented,” implemented through concrete practices:

• Client Selection and Focus:The company proactively selects clients and industries, focusing on serving those in medical electronics, automotive electronics, new energy, and industrial control who have high demands for product quality, reliability, and technical collaboration. Its typical order range of 50 to 10,000 units aligns with its market positioning of “small-to-medium volume, high reliability, full process.”
• Internal Management and Continuous Improvement:The company emphasizes establishing a robust quality control system (e.g., certifications like ISO 9001, ISO 13485) and a culture of continuous improvement, stimulating employee passion for quality through measures like quality performance boards and point systems.

Social Responsibility and Future Outlook Tortai Technologies believes that while achieving corporate growth, it must also strive to give back to society. Looking forward, the company plans a management upgrade to transition from a “technical subcontractor” to a “solution provider” and gradually develop its own products to achieve sustainable upward development.

Since its inception, Tortai Technologies Co., Ltd. has steadily evolved into a recognized player in specific EMS segments through a series of strategic steps and technical accumulation. Key milestones are listed below.

Start-up and Foundation Laying (2007-2013)

• Company Establishment and Positioning:Founded in 2007 with its headquarters in Humen Town, Dongguan, a location with strong supporting industry chains. From the outset, the company defined its core business as a professional provider of HMI components and comprehensive electronic assembly manufacturing services.
• Early Market Expansion:The company actively explored international markets, establishing cooperative relationships with clients from over forty countries and regions early on, laying a solid foundation for serving international clients.

Capability Building and System Certification (2014-2020)

• Deepening Service Capabilities:Continuous investment built integrated assembly capabilities from PCB OEM/ODM to silicone rubber products and plastic hardware products, aiming to provide comprehensive services.
• Quality System Upgrades:To meet the demands of high-end manufacturing clients, Tortai Technologies obtained critical international quality management system certifications, including ISO 9001:2015, ISO 13485 (Medical Devices), and the crucial IATF 16949 (Automotive). These certifications are its “passport” to serving high-reliability industries.

Strategic Focus and Systematization (2021-Present)

• Clarified Market Positioning:The company further refined its strategy, focusing on providing small/medium-volume, high-reliability, full-process EMS to specific industries. Its typical order focus on 50-10,000 units distinguishes it from players pursuing large-scale standardization.
• Expanded Service Scope:Services cover the entire electronics manufacturing flow, including PCB fabrication, SMT assembly, DIP insertion, testing, final assembly, and even packaging/logistics, aiming to offer one-stop solutions.
• Digital and Visual Upgrades:The introduction of an MES traceability barcode system enables order and product lifecycle management, enhancing production process transparency and traceability, vital for automotive and medical clients. The company also implements internal data security management systems to protect client intellectual property.

Within the EMS field, particularly in the small/medium-volume (50-10,000 units) and high-reliability segment, Tortai Technologies has established long-term partnerships with several well-known domestic and international companies based on its professional capabilities.

These collaborations indicate Tortai Technologies’ core value as a manufacturing partner:

• Focus on High-Reliability Sectors:Clients are concentrated in industries with extreme demands for product quality and reliability, supported by certifications like ISO 13485 and IATF 16949.
• Expertise in Small/Medium Batches & Collaborative R&D:Excelling in 50-10,000 unit orders, it emphasizes efficient small-batch sampling. Its ODM services include engineers with medical industry backgrounds, indicating value in early-stage collaborative design and engineering support beyond mere production.

Global Service Perspective: Serving clients globally, it has assisted overseas clients in transferring production to China for localized supply, showcasing international project management and supply chain integration capabilities.

Tortai Technologies deeply understands that proactively adapting to market shifts and leading technological iteration are key to maintaining core competitiveness in the fast-changing electronics manufacturing industry. It employs a systematic strategy to ensure flexibility for current markets while building momentum for future growth.

Dual-Driven Strategy: Empowering Existing Business & Exploring Future Growth A pragmatic and forward-looking two-track strategy balances short-term survival and long-term development:

• Empower Contract Manufacturing, Solidify the Foundation:R&D resources are prioritized to optimize existing contract manufacturing. This involves proactive DFM/A analysis, process improvement, and test fixture development to help clients improve first-pass yield and reduce costs, consolidating its advantage in the 50-10,000 unit market and strengthening client trust.
• Explore Proprietary Products, Plan for Future Growth:While ensuring contract manufacturing stability, the company cautiously invests resources to explore proprietary product development in familiar areas (e.g., medical wearables). This long-term path is crucial for accumulating core assets and transitioning beyond pure subcontracting.

Capability Upgrade: Evolution in Four Core Areas To support this strategy, Tortai Technologies is redefining and upgrading four core capabilities:

1. Technology: From Passive Support to Active Leadership.The technology department acts as a bridge between client needs and supply chain possibilities, deepening DFM/A capabilities. It focuses on前瞻性 process R&D for target industries (e.g., micro-fluidic control in medical electronics) to build technical barriers.
2. Quality: From Post-Event Inspection to Pre-Event Prevention.Emphasizing that quality is built in design and production, not just inspected. Systematic use of FMEA, SPC, and other advanced quality tools aims to eliminate potential risks early. High-reliability requirements are translated into clear, measurable technical indicators with clients.
3. Service: From Reactive Response to Proactive Care.Service spans the entire client lifecycle. Key clients receive dedicated project managers and regular progress reports. The goal is to upgrade from “order processor” to “project management expert,” providing value-added information like supply chain alerts.
4. Supply Chain: From Material Assurance to Strategic Synergy.The supply chain is viewed as a strategic resource. Supplier systems are strategically aligned with focused clients/products, fostering long-term partnerships with core suppliers. Process optimization enhances coordination from demand forecasting to production, ensuring delivery amidst volatility.

System Assurance: Organizational Vitality and Operational Resilience Strategy implementation relies on organizational and systemic support:

• Stimulating Organizational Vitality:The successful introduction of a partnership model in 2023, with 21 core talents becoming partners, has invigorated team collaboration and a spirit of co-creation, providing internal motivation for adaptation.
• Embracing Digital Intelligence:Implementing MES traceability systems and IP-guard data security tools enhances production transparency, traceability, and the security of data and intellectual property, forming the system foundation for managing more complex medium-volume projects.
• Adhering to the “Twenty Miles a Day” Philosophy:Believing in sustained, incremental progress, the company consistently advances through weekly/monthly reviews of core pain points like growth and talent, building resilience against long-term uncertainty.

Summary and Outlook Tortai Technologies’ strategy for adapting to market changes and technological iterations is a complete system encompassing survival assurance, future planning, capability building, and systemic support. It currently focuses on serving 50-10,000 unit high-reliability orders while systematically enhancing its capabilities to prepare for future larger-volume projects. If you seek a partner for complex, demanding electronic projects—one that can not only manufacture precisely but also grow and adapt with you—Tortai Technologies looks forward to in-depth discussions.

The factory scale and hardware configuration of Tortai Technologies clearly reflect its market focus on small/medium-volume, high-reliability EMS.

Production Scale and Hardware Configuration The production base in Humen Town, Dongguan, provides a solid physical foundation for its small/medium-volume, high-complexity business model.

• Production Facility Overview:The company operates a production plant of approximately 4,000 square meters, with multiple functional areas for PCBA manufacturing to enable seamless transition from rapid prototyping to small/medium-batch production.
• Core Production Line Configuration:The core electronic assembly lines are well-equipped to cover the complete process:

• SMT Lines:It possesses 4 SMT assembly lines, primarily using Japanese YAMAHA mid-to-high-speed placers to meet high-precision placement needs.
• DIP Lines:It is equipped with 2 DIP insertion lines for through-hole components.
• Assembly and Special Process Lines:Additionally, it has 2 final product assembly lines and 1 conformal coating line.

Team Size and Qualifications A stable technical team is key to ensuring product quality and reliability.

• Personnel Scale and Structure:The staff numbers approximately 80  The company plans to increase the proportion of technical personnel within the front-line production staff to over 40% in the future, reflecting its emphasis on technical expertise.
• Quality Management Systems:The company has obtained multiple international quality management system certifications, including ISO 9001, ISO 13485 (Medical Devices), and IATF 16949 (Automotive), which endorse its capability to serve high-reliability industries.

Technical Equipment and Quality Assurance Investment in inspection and equipment is core to its “high-reliability” promise.

• Inspection Equipment:The company has a complete inspection system including SPI, AOI, X-RAY, and ICT/FCT testing equipment, ensuring full-process quality control from solder paste printing to functional testing.
• Systematization Upgrades:In recent years, the introduction of an MES and ESD access control systems has realized production process transparency and data traceability, crucial for audits and quality tracing by medical and automotive clients.

We are a global EMS provider, having served over 300 clients across more than 40 countries and regions. Our primary client distribution includes:

• Asia:China, Japan, Singapore
• North America:USA, Canada
• Europe:Germany, UK, France, Italy, Netherlands, Austria
• Middle East:UAE

We possess extensive experience in international project management and logistics, enabling us to provide seamless communication and efficient delivery services to global clients.

TORTAI and Gaotuo Electronics (GTET) are brand names used by our company for different markets, belonging to the same entity.

• Gaotuo Electronics (GTET):Primarily used for serving the mainland China market, under the brand name “Dongguan Gaotuo Electronics Technology Co., Ltd.”
• TORTAI:Primarily used for serving the international market (including Hong Kong, North America, Europe, Japan, etc.), under the brand name “Tortai Technologies Co., Ltd.”, which was established in Hong Kong in 2007.

This dual-brand strategy allows us to serve global clients better and provide localized support tailored to the characteristics of different markets.

Yes, protecting client Intellectual Property (IP) is one of our highest principles. Before project initiation and any exchange of technical documentation, we insist on signing a formal Non-Disclosure Agreement (NDA) with every client.

We commit that all design files, BOMs, Gerbers, software, and any business information you provide will be kept strictly confidential, used solely for the authorized purpose of manufacturing your products. We have established a comprehensive internal information security management system to ensure the security of your data throughout the entire process.

Obtaining a quote is a straightforward process. You can submit your quotation request through our online inquiry system, via email at sales@tortai-tech.com, or by directly contacting your dedicated customer manager.

To facilitate a rapid and accurate quotation, please provide the following documents as comprehensively as possible:

Essential Documents

• Gerber Files: In RS-274X format, including all necessary layers (copper layers, solder mask, silkscreen, etc.).
• Bill of Materials (BOM): In Excel format, must contain complete component information: part number, manufacturer, package/value, reference designator, and quantity.
• Centroid / Pick-and-Place File: Used for programming the SMT placement equipment.

Supporting Documents (Highly Recommended)

• Assembly Drawing: In PDF format, clearly indicating component locations and orientation, especially for polarized components.
• Test Requirements and Methodology: Detailed specifications for any required tests (e.g., FCT – Functional Circuit Test) and acceptance criteria.
• Special Process Requirements: Instructions for specific processes such as conformal coating areas, potting requirements, or special soldering notes.

The more complete the information you provide, the more precise our quotation will be. Furthermore, a comprehensive data package allows for the early identification of potential issues before production begins, saving you valuable time and costs

Our PCBA turnkey service quotations strive for transparency and comprehensiveness. A standard quotation generally comprises the following components:

• PCB Bare Board Cost: Calculated based on substrate material, number of layers, manufacturing process, dimensions, and quantity.
• Component Procurement Cost: The cost of sourcing all electronic components according to your Bill of Materials (BOM). For partial component sourcing, costs are calculated based on the actual procured portion.
• Engineering Fee (NRE): A one-off charge covering SMT programming, stencil fabrication, first article verification, etc.
• Assembly Labour Cost: Includes labour and equipment expenses for SMT placement, DIP insertion, rework, etc.
• Testing Fee: Calculated based on the complexity and duration of required testing. AOI and X-Ray inspection are standard; ICT and FCT testing are quoted per specific solution.

Should your project involve special requirements such as conformal coating, potting, or finished product assembly, corresponding costs will be itemised separately within the quotation.

No. We specialise in small to medium batch production, fully understanding our clients’ needs during R&D, trial production, and early market launch phases. Consequently, we impose no minimum order quantity (MOQ). Whether it’s a single sample or a batch order of several thousand units, we welcome all orders equally and dedicate core engineering resources to support them.

We believe that by supporting our clients’ early-stage innovation, we can grow together and establish long-term strategic partnerships.

We offer flexible payment arrangements to accommodate varying client requirements. Standard terms are as follows:
For new clients: We typically operate on a prepayment basis, such as ‘50% deposit, 50% balance payable prior to shipment’. Specific percentages may be negotiated based on order value and project circumstances.

For established clients with good credit standing: We can offer more flexible payment terms, such as NET 30 days.
We accept multiple payment methods, including bank transfers (to corporate accounts). All commercial terms will be clearly stipulated in formal quotations and contracts to safeguard the interests of both parties.

We are delighted to accommodate and excel at handling bespoke service requests. Simply convey your specific ideas and requirements to our sales or engineering team. Whether it involves specialised processes, non-standard testing procedures, or complex finished product assembly, we will assemble a dedicated project team to liaise with you.
The communication process typically follows these steps:

• Requirement Discussion: You present your initial bespoke requirements to us.
• Technical Assessment: Our engineering team evaluates technical feasibility, potential risks, and required resources.
• Solution Development: We provide a detailed customised proposal, including process flow, timeline, and quotation.
• Solution Confirmation: Both parties jointly review and finalise proposal details until mutual agreement is reached.
• Project Execution: We strictly implement the project according to the confirmed solution.

Yes, this is one of our core services. We strongly support clients in sample production and small-batch trial runs prior to mass production. This not only helps you validate design accuracy but also enables us to identify and resolve potential manufacturing issues early on, optimising production processes.

Our NPI (New Product Introduction) process is specifically tailored for the sampling and trial production stages, ensuring rapid delivery and high-quality feedback.

We understand design changes may occur during project progression. Our approach to handling alterations is: communicate early to minimise impact.

• Before component procurement and PCB production: You may modify the design or BOM at any time; we will simply reassess and provide a new quotation.
• After component procurement and PCB production commencement: Changes may incur additional costs and cause delays. For instance, procured components may be non-returnable, and manufactured PCB blanks may require scrapping. Our project manager will promptly liaise with you to assess the impact of the change and propose the optimal solution for your decision.

Therefore, we strongly advise completing all final design reviews prior to order confirmation.

For components supplied by customers or materials remaining after order completion, we offer two processing options:

• Return with shipment: We will inventory, organise, and package all surplus materials, returning them to you alongside the finished goods.
• Inventory Management: Should you have ongoing order requirements, with your authorisation, we can securely store surplus materials in our temperature- and humidity-controlled warehouse. A dedicated inventory ledger will be maintained for future production orders, thereby reducing your logistics costs and inventory management workload.

A formal material management agreement will be executed to ensure the security, transparency, and traceability of your assets.

We strictly adhere to the internationally recognised electronic assembly acceptance standard IPC-A-610 (Acceptability of Electronic Components). Our default delivery standard is Class 2, which is also the universal standard for most commercial and industrial-grade electronic products.
For projects with heightened reliability requirements—such as medical, automotive, and aerospace applications—we possess the capability to manufacture and inspect to the highest Grade 3 standard. This tier imposes more stringent demands on soldering quality, component placement accuracy, cleanliness, and other aspects, representing the pinnacle of high-reliability electronics manufacturing.

We fully recognise that quality systems form the bedrock of product reliability. To this end, we have made sustained investments and successfully attained multiple internationally recognised quality and industry system certifications, including:

• ISO 9001:2015: An internationally standardised quality management system, serving as the foundation for all our operational activities.
• IATF 16949:2016: The global automotive industry’s quality management standard, demonstrating our capability to deliver products and services meeting stringent requirements for automotive electronics clients.
• ISO 13485:2016: The quality management standard for the medical device industry, serving as our key qualification for serving healthcare clients and ensuring product safety and efficacy.
• ISO 14001:2015: Environmental Management System certification, reflecting our commitment to sustainable development and environmental protection.

Furthermore, our products comply with environmental directives such as RoHS and REACH.

We firmly believe that high-quality PCBA originates from high-quality components. Therefore, we have established a rigorous Incoming Quality Control (IQC) process:

• Supplier Qualification: We exclusively procure components from authorized distributors or reputable channels such as Digi-Key, Mouser, and Arrow.
• Verification and Inspection: Upon arrival, our IQC team meticulously verifies purchase orders, delivery notes, and physical components to ensure accuracy in model numbers, quantities, and lot codes. Additionally, we inspect component packaging, appearance, and markings.
• Parameter Sampling: For critical components or high-risk materials, we conduct sampling tests on core parameters using instruments such as LCR bridges.
• Pre-loading Verification: Prior to SMT line loading, all materials undergo secondary verification through barcode scanning by operators to prevent material misplacement.

We have established multiple critical in-process quality control points (IPQC) throughout the production workflow to ensure defects are detected and rectified at the earliest opportunity:

• SPI Solder Paste Inspection: Following solder paste printing, 100% of pads undergo 3D SPI inspection to verify solder paste height, volume, area, and shape comply with process specifications.
• FAI First Article Inspection: At the commencement of each production batch, the first assembled PCBA undergoes comprehensive FAI inspection using an intelligent system to confirm all component types, orientation, and placement are entirely correct.
• AOI Optical Inspection: Following SMT reflow soldering and DIP wave soldering, 3D AOI equipment inspects 100% of PCBA boards to identify surface defects such as incorrect components, missing components, tombstoning, bridging, and cold solder joints.
• X-Ray Inspection: For components with bottom pads such as BGAs and QFNs, 100% X-ray inspection is performed to examine internal solder joints for voids, bridging, and open circuits.
• IPQC Patrol Inspection: Our IPQC engineers conduct continuous patrol inspections throughout production to monitor process parameter stability and perform sampling checks on critical processes.

Answer: We offer a comprehensive suite of PCBA testing solutions to ensure the products delivered to you are fully functional and perform reliably. Our testing services are tiered as follows:

It is standard practice and incurs no additional charge. We firmly believe that for devices with bottom-mounted pads such as BGAs, QFNs, and LGAs, soldering quality cannot be assured without X-ray inspection. Consequently, we incorporate 100% X-ray inspection as an integral part of our standard process flow, included within the assembly quotation. We are committed to delivering ‘transparent’ quality, ensuring your complete confidence in every invisible solder joint.

FAI (First Article Inspection) refers to the comprehensive and rigorous inspection of the first PCBA produced before commencing mass production. This verifies that all production elements (personnel, machinery, materials, methods, environment) are in the correct state. It is a critical step in preventing errors during large-scale production.
Our implementation method is as follows:

• Production of the First Board: The SMT production line assembles and solder-bonds the first PCBA.Equipment Scanning: Utilising the FAI-6400 Intelligent First Article Inspection System, high-definition scanning generates images of the PCBA, which are automatically compared against the Bill of Materials (BOM) and coordinate files.
• Parameter Measurement: The system automatically drives the LCR bridge to perform actual measurements on every resistor, capacitor, and inductor on the board, comparing these against the specifications required by the BOM.
• Manual Verification: Our engineers conduct secondary manual confirmation of any discrepancies detected by the equipment, as well as all polarised and directional components.
• Report Generation: Upon completion of all inspections, the system generates a detailed first article inspection report documenting all measured values and comparison results. Only after the report is confirmed to be 100% accurate will mass production commence.

We have established a comprehensive closed-loop quality management process to address any potential quality concerns:

• Issue Response: Upon receiving your feedback or identifying any quality issues internally, our Quality Department will respond immediately by forming an issue analysis team.
• Root Cause Analysis: We employ quality tools such as 8D reports and fishbone diagrams to thoroughly investigate the fundamental cause from multiple dimensions including personnel, machinery, materials, methods, and environment.
• Traceability: Each PCBA is assigned a unique barcode. Through our MES system, we can trace all relevant information including production time, material batches used, operators, and equipment parameters, providing data support for root cause analysis.
  Corrective and Preventive Actions: Upon identifying the root cause, we will immediately implement corrective measures (such as rework or scrapping) and establish long-term preventative actions. This includes updating process documentation or operating manuals to prevent recurrence.
• Rework Process: PCBA requiring rework undergoes operations by professionally trained technicians at dedicated workstations (e.g., BGA rework stations). Reworked products undergo comprehensive testing equivalent to new units to ensure compliance with quality requirements.

Our 4,600-square-metre facility houses highly automated and flexible production lines designed to support small-to-medium batches and high-complexity manufacturing requirements. The primary production line configurations are as follows:

• 4 Yamaha high-speed SMT production lines: Capable of 1.2 million components per day, flexibly handling tasks from rapid prototyping to medium-volume production.
• 2 DIP insertion lines: Incorporating automatic insertion machines and Nitto selective wave soldering, balancing efficiency with soldering quality for complex components.
• 1 ANDA selective conformal coating line: Delivers precise, uniform application to meet protective requirements for high-reliability products.
• 2 box-build assembly lines: Provide end-to-end services from PCBA to final product assembly, testing, and packaging.
• 4 low-pressure injection moulding machines: Employ low-pressure encapsulation for PCBA, offering superior protection for electronic modules operating in harsh environments.

Our Yamaha SMT production line possesses outstanding precision placement capabilities, capable of handling components of various sizes and types:

• Minimum placement component: Stable placement of ultra-micro components as small as 01005 (0.3mm × 0.15mm).
• Maximum placement components: Capable of handling large components up to 200mm × 125mm in size and 25.4mm in height.
• Placement accuracy: Our equipment achieves placement accuracy of ±22μm @ 3σ and rotational accuracy of ±0.05° @ 3σ, fully meeting the assembly requirements for high-density, fine-pitch products.

We possess the capability to process PCBs of various specifications to meet the design requirements of different products:

• PCB Layers: We can handle PCBs ranging from 1 to 32 layers, including standard rigid PCBs, flexible PCBs (FPC), and rigid-flex PCBs.
• PCB Dimensions: Standard production runs: Supports dimensions ranging from 50mm × 50mm to 850mm × 560mm. Prototyping limits: For specialised projects, such as new energy control boards, we have successfully manufactured ultra-long PCBs up to 1500mm in length.

We continuously invest in industry-leading equipment to ensure process capability and product quality. Our key equipment includes:

• Placement machines: YAMAHA YSM series medium-to-high-speed placement machines, renowned for high precision and flexibility.
• Reflow Ovens: JT Ten-Zone Nitrogen Reflow Ovens, alongside Nitrogen Vacuum Reflow Ovens for high-reliability soldering, achieving industry-leading void reduction rates.
• Wave Soldering: NITTO Selective Wave Soldering, specialised for complex through-hole assembly on high-density, double-sided mixed-assembly boards.

Inspection Equipment

• SPI: Pemtron 3D Solder Paste Inspection System.
• AOI: S-T-K 3D Automated Optical Inspection System.
• X-Ray: UNICOMP 3D X-Ray Inspection System for detecting invisible solder joints in BGAs, QFNs, etc.
• FAI: FAI-6400 Intelligent First Article Inspection System, ensuring absolute accuracy of the first production unit.

Notably, our nitrogen vacuum reflow oven represents a key speciality. It significantly reduces void rates beneath solder joints for components like BGAs and QFNs, serving as a critical technology for enhancing the long-term stability of high-reliability products in sectors such as medical and automotive electronics.

Yes, we provide a comprehensive Box-Build Assembly service. Beyond core PCBA manufacturing, we can complete the entire assembly, testing, and packaging process from PCBA to final finished product according to customer requirements. Our finished product assembly services include:

• Procurement and integration of sub-components such as enclosures, wiring harnesses, displays, and batteries.
• Whole-unit functional testing, ageing tests, and safety testing.
• Software programming and system configuration.
• Customised packaging, labelling, and accessory provision.

By utilising our finished product assembly services, you may outsource the entire manufacturing process to us, thereby streamlining your supply chain and enabling you to focus on your core R&D and market operations.

We possess extensive experience and advanced equipment for handling BGA components, with the following capabilities:

• Minimum pitch: We can reliably place and solder BGA and CSP devices with pitches as small as 0.30mm.
• Soldering quality: By employing nitrogen-filled vacuum reflow soldering, we maintain void rates beneath BGA solder joints below 2%, significantly outperforming the industry standard of 25% for conventional reflow processes, thereby substantially enhancing soldering reliability.
• Inspection Capability: All BGAs undergo 100% inspection via 3D X-ray to ensure absence of defects such as bridging, cold solder joints, or pillow effect.
• Repair Capability: Our dedicated BGA rework stations enable safe removal, reballing, and resoldering of BGAs, followed by X-ray verification to guarantee repair quality.

We employ a combination of manual insertion and automated equipment to balance efficiency, quality, and flexibility.

• Automatic insertion machines: For standardised axial and radial components, we utilise automatic insertion machines to enhance production efficiency and consistency.
• Selective Wave Soldering: For high-density, heat-sensitive, or boards unsuitable for full reflow, we employ Nitto selective wave soldering for localised soldering, ensuring both solder joint quality and component safety.
• Skilled Manual Reflow Soldering: For irregularly shaped, non-standard, or components requiring special angle mounting, we utilise hand soldering by technicians trained to IPC standards, with dedicated personnel conducting quality inspections.

Yes, we do. Our production lines offer excellent flexibility to handle PCBs of various non-standard dimensions.

• Extra-long PCBs: Our SMT production lines have been modified to support PCBs up to 1.5 metres (1500mm) in length during the prototyping stage, making them ideal for manufacturing requirements such as LED light strips and new energy control strips.
• Non-standard shaped PCBs: For circular, polygonal, or other irregularly shaped PCBs, we possess extensive experience in panelisation and fixture design, ensuring stability and reliability throughout SMT, DIP, and testing processes.

Should you have any non-standard PCB projects, please contact our engineering team. We will provide professional process evaluations and tailored solutions.

Our core technological strengths lie in our profound understanding and relentless pursuit of high-reliability manufacturing processes, particularly evident in the following areas:

• Vacuum Soldering Technology: Our nitrogen-filled vacuum reflow ovens reduce void rates in bottom-pad components such as BGAs and QFNs from the industry standard of 25% to below 2%. This is crucial for medical, automotive, and industrial products requiring long-term stable operation, as lower voiding rates translate to enhanced resistance to thermal cycling and mechanical stress.
• Precision Manufacturing Capabilities: We possess stable processing capabilities for 01005 components, 0.3mm pitch BGAs, and 32-layer high-density PCBs. This is achieved through the synergistic operation of our advanced Yamaha pick-and-place machines, 3D SPI, and 3D AOI equipment, enabling comprehensive 3D inspection throughout the entire process.
• Selective Soldering Process: We employ Nitto Japan’s selective wave soldering technology. Compared to conventional wave soldering, it enables precise soldering of specific through-hole areas, avoiding thermal shock to adjacent SMT components. This makes it an effective solution for the soldering challenges of high-density double-sided mixed-assembly boards.
• Comprehensive Protection Process: We provide a complete range of protective solutions, from selective conformal coating and precision potting (resin filling) to low-pressure injection moulding encapsulation. These solutions meet stringent operational requirements in harsh environments characterised by humidity, vibration, and high contamination.

Yes, we support multiple specialised PCB and PCBA processes to meet the unique performance requirements of diverse products:

• Thick Copper Boards: Capable of processing PCBs with copper thicknesses up to 15oz, suitable for new energy and industrial control products requiring high current-carrying capacity and superior thermal dissipation.
• High-Frequency/High-Speed Boards: We possess extensive experience in handling high-frequency materials such as Rogers and Teflon. Our ±5% precision impedance control ensures signal integrity for communication and RF products.
• Rigid-Flex PCBs: Capable of manufacturing and assembling rigid-flex boards, providing solutions for compact products requiring three-dimensional routing, space-saving designs, and enhanced reliability.
• Other Specialised Processes: We additionally support HDI, countersunk holes, specialised inks (such as matt black ink), ceramic substrates, metal substrates, and numerous other specialised techniques.

Nitrogen vacuum reflow soldering is a core technology of ours, delivering decisive reliability enhancements for your products. Key advantages include:

• Exceptionally low solder joint void rates: By applying vacuum during the latter stages of soldering, we effectively eliminate bubbles formed within joints due to flux volatilisation. We consistently maintain void rates below 2%, whereas conventional reflow processes typically exhibit rates between 15% and 25%.
• Significantly enhanced reliability: Low void rates translate to solder joints with superior mechanical strength and thermal conductivity. This enables better endurance against prolonged thermal cycling and vibration shocks, substantially extending product lifespan and reliability in demanding environments.
• Enhanced thermal dissipation: For devices with bottom heat sinks such as QFN and LGA packages, low porosity ensures efficient heat transfer from the chip to the PCB, preventing performance degradation or premature failure due to localised overheating.

This process is particularly recommended for applications demanding extreme reliability, including automotive electronics, medical equipment, high-power power modules, and aerospace systems.

We provide professional conformal coating services to protect PCBA from environmental factors such as moisture, salt spray, mould, and dust. We utilise an ANDA selective conformal coating automated spraying line, which offers greater precision, consistency, and efficiency compared to manual brushing.

• Application Method: Primarily selective automated spraying, precisely controlling coating areas, thickness, and shapes via programmed settings. This effectively prevents contamination of ‘no-go zones’ such as connectors and test points.
• Selectable Materials: We support multiple types of conformal coatings including acrylic, polyurethane, and silicone. Clients may select based on their product’s specific operating environment and cost budget.
• Quality Standards: Our conformal coating process adheres to the IPC-CC-830 standard, ensuring uniform coating without bubbles or orange peel. Full inspection via UV lamps guarantees complete coverage integrity.

Yes, we provide both of these high-level protective processes, delivering “armour-grade” protection for electronic modules operating in extremely harsh environments.

• Electronic Potting: We place the PCBA within an enclosure and inject liquid adhesives such as epoxy, polyurethane, or silicone. Upon curing, this forms a robust protective layer. This process delivers outstanding waterproofing, moisture resistance, vibration damping, chemical corrosion resistance, and electrical insulation properties.
• Low Pressure Moulding: This process utilises extremely low injection pressure (1.5-40 bar) to encapsulate thermoplastic materials around the PCBA. Compared to traditional potting, it offers advantages including a short production cycle (completed in tens of seconds), minimal stress on components, and exceptional sealing properties. It is highly suitable for high-volume, high-reliability applications such as automotive sensors and outdoor controllers.

Achieving stable placement of components as small as 01005 (0.3mm × 0.15mm) requires a comprehensive precision process control system:

• High-precision equipment: We utilise Yamaha YSM series placement machines, whose high-resolution vision systems and rigid chassis form the foundation for precision placement.
• Precision stencils: Laser-cut, electropolished stencils are employed, with aperture designs optimised for 01005 characteristics (e.g., solder ball prevention) to ensure precise and consistent solder paste printing.
• 3D SPI inspection: Post-printing, 3D SPI is used for 100% inspection of each solder paste pad’s height, volume, and area, eliminating solder paste-related defects at source.
• Optimised Placement Parameters: Our engineers fine-tune placement pressure, speed, and nozzle type to ensure precise yet gentle pickup and placement of 01005 components.
• Precise Temperature Zone Control: Our ten-zone reflow oven delivers accurate temperature profile control, guaranteeing optimal soldering results for both micro-components and larger parts.

We possess rigorous impedance control capabilities, which are critical for the transmission of high-frequency, high-speed signals. Through collaboration with leading PCB manufacturers and combined with our internal process control, we can consistently maintain the characteristic impedance of PCBs (such as single-ended 50Ω, differential 100Ω) within a tolerance of ±5% at a high precision level.

Achieving this requires comprehensive management throughout the entire process—from PCB design, laminate structure, substrate selection, and trace width/spacing control to final TDR (Time Domain Reflectometer) testing.

Yes, we possess NITTO selective wave soldering equipment from Japan. This advanced through-hole soldering technique employs a micro solder nozzle to perform point-by-point or drag soldering exclusively on pins requiring connection.

Selective wave soldering is primarily suitable for the following scenarios:

• High-density double-sided mixed-assembly boards: When one side of the PCBA has already been populated with SMT components (particularly sensitive components near through-hole vias), and DIP through-hole components require soldering on the opposite side, selective wave soldering avoids secondary heating of the already-mounted components, preventing their dislodgement or damage.
• Boards with crimped components or heat-sensitive elements: For boards containing heat-sensitive components such as crimped connectors or plastic housings, selective wave soldering bypasses these areas, targeting only the pins requiring soldering.
• Replacing costly manual soldering: Compared to manual soldering, selective wave soldering allows precise control over parameters (temperature, time, solder volume), yielding greater consistency and reliability while enhancing production efficiency.

Yes. We do continue to provide after-sales support after the order is delivered. If there is a problem with our manufacturing process, our experts will assess and fix, rework or rework by identifying the root cause of the problem. If you need any assistance, please send us sales@tortai-tech.com or contact us at 86-189 2251 6196. We will deal with it for you as soon as possible. Thank you for choosing TORTAI.

To be honest, this happens really very rarely. But if this happens, please contact the relevant courier company as soon as possible to get the latest delivery time. While legally we are not responsible for delays, we still track or call couriers to get the latest logistics status. In the worst case, we will remake the product for you and reship it to you. For additional courier and other costs, we may contact the courier company for reimbursement. Thank you for choosing TORTAI.

Thank you very much for your trust in our company, if you have any questions, you can send an email sales@tortai-tech.com or call 86-189 2251 6196.Contact our sales team, we are on call 24 hours for you.

Thank you very much for your inquiry, our factory is generally closed on Sundays and public holidays. Whenever we receive your order or email, we will immediately start checking your requirement details and will respond to your email request within 24 hours. Our online working hours are: 7/24/365. Thank you for choosing TORTAI.